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Devendra Verma (Dev)

Accomplished Materials and Mechanical Engineer with over 13 years of experience in semiconductor technology, supplier management, and advanced materials development.

Expertise in driving business impact through data-driven problem-solving, project management, and innovation in semiconductor processes.

Adept at leading global supplier relationships, optimizing supply chains, and developing new technologies in high-demand industries.

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AWARDS

Purdue University

  • Outstanding Service Scholarship, 2015

  • 2nd prize, Academic Engagement Poster, 2014

  • Graduate Student Excellence Award, 2014

  • Office of Engagement Grant, 2013

 

Travel Awards

  • Haythornthwaite Foundation Student Travel Award, 2015

  • Society of Engineering Science Travel Award, 2015

  • United States Association for Computational Mechanics, 2014

  • NSF Fellowship, 2013

  • Erasmus Mundus (Europe) Exchange Program Scholarship, 2011

TECHNICAL SKILLS

Nanoindentation

Nano-impact

High Temperature(800 C)

Aqueous Environment

High strain rate

Nanomechanical Raman Spectroscopy

Non destructive stress tensor measurements

Finite Element Analysis

Material constitutive model implementation with UMAT, VUMAT

SEM

EDX

Elemental composition and microstructure analysis

MY LATEST RESEARCH

Impact Simulations using ABAQUS/EXPLICIT with user subroutine VUMAT implementation.

WEST LAFAYETTE, Ind. – New research is revealing details about how the exoskeleton of a certain type of deep-sea shrimp allows the animal to survive scalding hot waters in hydrothermal vents thousands of feet under water.​

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