Awesome Engineer | Purdue + IIT-K
​Strategic Sourcing | Supplier Management | Technology Development
Devendra Verma, Ph.D.
Devendra Verma, Ph.D. (Dev)
Sales + R&D + Supply Chain > Over a decade in semiconductor technology, team/supplier management, and advanced process/materials development.
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GSEM Excellence Award, Intel EPIC Supplier Award, and top performer at Intel Corporation every year.
2 Patents and 27 publications in advanced materials and semiconductor processes.
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AWARDS
Industry/Intel Corporation
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Intel EPIC Supplier Award，2025
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QPB+, Top Intel Group Performance，2024
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GSEM Excellence Award Winner, 2024
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QPB+, Top Intel Group Performance, 2022
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Patents filing for Ceramic engineering, 2022
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Purdue University
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Outstanding Service Scholarship, 2015
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2nd prize, Academic Engagement Poster, 2014
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Graduate Student Excellence Award, 2014
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Office of Engagement Grant, 2013
Travel Awards
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Haythornthwaite Foundation Student Travel Award, 2015
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Society of Engineering Science Travel Award, 2015
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United States Association for Computational Mechanics, 2014
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NSF Fellowship, 2013
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Erasmus Mundus (Europe) Exchange Program Scholarship, 2011
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TECHNICAL SKILLS
Nanoindentation
Nano-impact
High Temperature(800 C)
Aqueous Environment
High strain rate
Nanomechanical Raman Spectroscopy
Non destructive stress tensor measurements
Finite Element Analysis
Material constitutive model implementation with UMAT, VUMAT
SEM
EDX
Elemental composition and microstructure analysis
Ph.D. RESEARCH
Impact Simulations using ABAQUS/EXPLICIT with user subroutine VUMAT implementation.
WEST LAFAYETTE, Ind. – New research is revealing details about how the exoskeleton of a certain type of deep-sea shrimp allows the animal to survive scalding hot waters in hydrothermal vents thousands of feet under water.​
